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Title:
MANUFACTURE OF PARTICLE BOARD WITH EXCELLENT WATER RESISTIVITY
Document Type and Number:
Japanese Patent JPH03132303
Kind Code:
A
Abstract:

PURPOSE: To efficiently manufacture a particle board with excellent water resistivity by heat-pressing oligoesterified lumber chips having polymeric double bond and a reactive product material consisting of oligomer having polymeric double bond.

CONSTITUTION: Oligoesterified lumber chips obtained by reacting dibasic acid anhydride such as allylglycidylether, glycidylmethacrylmethacrylate composition, or the like and monoepoxy composition having polymeric double bond, to lumber chips and an reactive product material consisting of oligomer are subjected to forming so as to be a predetermined thickness and thereafter the forming mat is thermal-pressed for about 0.2-5.0 min at a temperature of 80-180°C under the pressure of the order of 5-60kg.f/m2. As a result, the oligoesterified lumber chips and the polymeric double bond of the oligomer are polymerized, thereby obtaining a firmly combined particle board.


Inventors:
MORI HIDEKI
UEDA MINORU
MATSUDA HIDEAKI
Application Number:
JP27079989A
Publication Date:
June 05, 1991
Filing Date:
October 17, 1989
Export Citation:
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Assignee:
OKURA INDUSTRIAL CO LTD
International Classes:
B27N3/02; B27N3/06; B27N3/08; (IPC1-7): B27N3/02; B27N3/06; B27N3/08
Domestic Patent References:
JPS63183910A1988-07-29



 
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