Title:
MANUFACTURE OF PARTICLE BOARD
Document Type and Number:
Japanese Patent JPH0976212
Kind Code:
A
Abstract:
To provide a manufacturing method of a three-layer structure particle board, which does not stick to the hot plate of a press irrespective of the fact that methylenediphenyl diisocyanate resin bonding agent (MDI resin bonding agent) is used on not only the surface layer but also on the surface layer.
A layer 11 is a surface layer formed by mixing an amino bonding agent and a MDI resin bonding agent and applying it. A layer 12 is the surface layer formed by applying the MDI resin bonding agent, to which a fluorine mold parting agent is added. Further, a layer 13 is a core layer formed by applying the MDI resin bonding agent.
Inventors:
ITO EIJI
Application Number:
JP26644595A
Publication Date:
March 25, 1997
Filing Date:
September 19, 1995
Export Citation:
Assignee:
DANTANI PLYWOOD CO
International Classes:
B27N3/02; B27N3/06; (IPC1-7): B27N3/02; B27N3/06
Next Patent: MANUFACTURE OF CONCRETE BLOCK AND DEVICE THEREFOR