PURPOSE: To form a printed board of economical and highly reliable construction which does not need through-hole plating by solder-jointing an interlayer and a side wall of a land section.
CONSTITUTION: Circuit patterns 2a, 2b and lands 21a, 21b are formed by etching onto single-sided boards 1a, 1b which are then bonded by insulating adhesive 3 by opposing circuit faces. Adhesive is not applied to the land sections 12a, 12b. A lead wire 7 is inserted to a hole of the land then solder-joint 6 is made to the lands 21a, 21b and the lead wire 7. Since this process does not need through-hole plating, pollution is not caused. The process is economical and highly reliable in comparison with joint using eyelet, etc. It also allows to laminate more than three boards by using a double-sides board.
NOMOTO KAORU
KONDO KOJI
ISHIDA NOBUMASA
ISHIKAWA JUNJI
