Title:
MANUFACTURE OF PRINTED-CIRCUIT BOARD, AND TRANSCRIBING FOIL FOR FORMING CIRCUIT
Document Type and Number:
Japanese Patent JP3118276
Kind Code:
B2
Abstract:
PURPOSE: To obtain a printed circuit board having a function for shielding circuits from electromagnetic waves with a good productivity.
CONSTITUTION: A transcribing foil for forming circuits, which is obtained by laminating in succession a circuit pattern layer 2 made of a carbon paste ink, an insulation layer 3 made of an epoxy based resin, a layer 4 for shielding circuits from electromagnetic waves, which is made of a silver paste ink, and a bonding layer 5 made of an acrylic resin, on a substrate sheet 1, whose surface is subjected to a mold releasing treatment by silicon coating. A manufacturing method of the printed circuit board having a function for shielding circuits from electromagnetic waves, wherein the bonding layer 5 of the transcribing foil for forming circuits is superimposed on a base board 6 made of an epoxy resin, and after the transcribing foil is subjected to a thermocompression by a silicon roll, the substrate sheet 1 is peeled.
Inventors:
Tadasu Taniguchi
Tadao Baba
Kentaro Fujii
Tadao Baba
Kentaro Fujii
Application Number:
JP18365891A
Publication Date:
December 18, 2000
Filing Date:
June 27, 1991
Export Citation:
Assignee:
NISSHA PRINTING CO.,LTD.
International Classes:
H05K1/02; H05K3/20; H05K9/00; H05K1/09; (IPC1-7): H05K3/20; H05K1/02; H05K9/00
Domestic Patent References:
| JP63204788A | ||||
| JP63132498A |