PURPOSE: To prevent generation of a solder bridge by removing an unexposed part by development after exposing front-to-rear continuity through-hole alone which requires blocking inside a front-to-rear continuity through-hole and by blocking the through-hole by heat hardening.

CONSTITUTION: Liquid-type SR(solder resist) ink 2 is applied all over a printed wiring board and dried to form a semihardened photosensitive layer. Then, a specified SR pattern is burned by UV light 4 through a mask film 3, and an unexposed part is removed by developer. The liquid-like SR ink 2 is laminated, applied and dried. After, exposure by UV light 4 through a mask film 3 which performs light-screening for a part excepting a front-to-rear continuity through-hole 1 requiring blocking, an unexposed part is removed by development. Lastly, heating treatment is carried out and a printed wiring board is acquired.