PURPOSE: To make it possible to make the plating film stable and the thickness uniform when copper plating is performed on a through-hole, etc., in a printed wiring board.
CONSTITUTION: Copper is reclaimed from etching waste liquid in a general manufacturing of a printed wiring board, the copper is poured into a dissolving tank 23 from a powder feeder 21 to make a copper ion solution. A substrate 1 that is made an anode 28 and a cathode is arranged facing each other in a plating tank 26 to copper-plate the substrate 1. The copper ion solution is supplied from the dissolving tank 23 to the plating tank 26 to maintain the concentration of the copper ion of the plating solution 27 at a specified value. Since an insoluble electrode plate can be used as an anode 28, the current density is stabilized.
TAKISHIMA TOICHI
SAKATA YASUHIKO
