Title:
MANUFACTURE OF PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JPH06310852
Kind Code:
A
Abstract:
PURPOSE: To provide a method of manufacturing a printed-wiring board having excellent bond properties to an electrodeposited copper.
CONSTITUTION: A through hole is formed by drilling a specific position on the printed-wiring board comprising an insulating substrate with at least both surface and rear surface thereof coated with a metallic foil and then a conductive polymer is formed on the through hole innerwall part to be made conductive to perform electroplating step and soft etching step after the formation of the conductive polymer.
Inventors:
NAGAI MIZUKI
SHIMAZAKI TAKESHI
TAKANO HISAO
SHIMAZAKI TAKESHI
TAKANO HISAO
Application Number:
JP9772593A
Publication Date:
November 04, 1994
Filing Date:
April 23, 1993
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/42; (IPC1-7): H05K3/42
Attorney, Agent or Firm:
Kunihiko Wakabayashi
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