Title:
MANUFACTURE OF PROBE AND CIRCUIT BOARD USED THEREFOR
Document Type and Number:
Japanese Patent JP3050519
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress variation in heights by providing a dummy through hole with a conductive circuit exposed inside in the vicinity of a through hole forming a bump contact whose height is to be controlled and performing electrolytic plating.
SOLUTION: A plurality of bump contacts 2 are formed on one of faces of an insulating board 1 of a probe, while a conductive circuit 3 is formed on the other face, and both are made conductive by metal in a through hole 4. The circuit 3 exposed in the through hole 4 is made to be a cathode, the through hole 4 is filled with metal by electrolytic plating, and the metal is made to protrude to form the bump contact 2. In this case, in the vicinity of a through hole 4a with a contact 2a whose height is to be reduced, one or more dummy through holes 4c with the circuit 3 exposed inside are provided to form contacts 2a. Thus a height of the contact 2a can be reduced. In this manner, contacts 2 with little variation in height can be easily formed.
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Inventors:
Yoshiya Takayama
So Kazunori
Kiyoshi Miyake
Hiroshi Yada
So Kazunori
Kiyoshi Miyake
Hiroshi Yada
Application Number:
JP4892796A
Publication Date:
June 12, 2000
Filing Date:
March 06, 1996
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G01R1/06; G01R3/00; H01L21/60; H01L21/66; H01L23/12; H05K3/40; (IPC1-7): H01L21/60; G01R1/06; G01R3/00; H01L21/66; H01L23/12
Domestic Patent References:
| JP3250639A | ||||
| JP8170198A | ||||
| JP8213399A | ||||
| JP8274102A | ||||
| JP1112743A |
Attorney, Agent or Firm:
Hajime Takashima