PURPOSE: To enhance adhesion between a photoresist to be used for a dry resist process and a copper coated support by incorporating a specified aliphatic polyol.

CONSTITUTION: The transferable and radiation plymerizable photoresist layer (A) composed essentially of a polymer binder and an ethylenically unsaturated compound (a) and a polymerization initiator is formed on the flexible transparent and temporary support and a strippable cover sheet is formed on the layer (A) and the layer (A) contains the aliphatic polyol having 2-15 hydroxy groups, such as polyethylene glycol, preferably, in an amount of 0.1-5weight% of the volatile components of the layer (A), and a compound having a boiling point of higher than 100°C at normal pressure and polymerizable by the free radical process is used for the compound (a), preferably, a compound having ≥2 ethylenically unsaturated groups, such as an ester of (meth)acrylic acid and a polyol.