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Patent Searching and Data


Title:
MANUFACTURE OF RESIN MOLDING OF POOR MOLDABILITY
Document Type and Number:
Japanese Patent JPH10119070
Kind Code:
A
Abstract:

To remove a non-reactive gas from a resin naturally after molding and to eliminate the recovery of an organic solvent by a method in which the non-reactive gas which is gas at room temperature and atmospheric pressure is dissolved in a resin of poor moldability at a high pressure, the pressure is reduced, and the resin is pressurized and molded at temperatures which allow the resin to be deformed plastically.

Carbon dioxide as a non-reactive gas is dissolved in ultrahigh molecular weight polyethylene (average molecular weight 2,300,000; melting point 136°C) of a ultrahigh viscosity material as a resin of poor moldability at 60°C and 150kg f/cm2 for 24hr in an autoclave, and the pressure is reduced to atmospheric at room temperature. The resin immediately after the pressure reduction is press-molded at 150°C and 30kg/cm2 for 30sec by a press, cooled at room temperature, and solidified, and the resin is released from the pressure to obtain a sheet 0.5mm in thickness.


Inventors:
MATSUMOTO HIDESHI
DEGUCHI KOUKI
ICHIHARA KOJI
Application Number:
JP27633396A
Publication Date:
May 12, 1998
Filing Date:
October 18, 1996
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C43/02; B29C43/32; B29C43/56; B29C67/00; B29K23/00; (IPC1-7): B29C43/02; B29C43/32; B29C43/56; B29C67/00