Title:
MANUFACTURE OF SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPH04271140
Kind Code:
A
Abstract:
PURPOSE: To obtain the manufacturing method of a semiconductor chip capable of preventing damage due to silicon cutouts generated on the sidewall in a cutting and separation process of semiconductor chips, regarding the improvement of a method for dividing a semiconductor substrate into semiconductor chips.
CONSTITUTION: The title manufacturing method includes the following; a first separation process for dividing a semiconductor substrate 1 stuck on a tape 2 into individual semiconductor chips 1a without cutting the tape, a process for injecting resin 3 in a scribe trench 1b formed between separated semiconductor chips 1a, and a second cutting process for forming a cutting trench 3a and separating the above semiconductor chips 1a.
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Inventors:
ANDO NOBORU
Application Number:
JP3258491A
Publication Date:
September 28, 1992
Filing Date:
February 27, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Sadaichi Igita