Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE, PRESS DIE, AND GUIDE RAIL
Document Type and Number:
Japanese Patent JP3532395
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, wherein a sealing resin is prevented from damages and the occurrence of resin fragment is suppressed and also to provide a press die and a guide rail for which the generation of resin fragment is suppressed.
SOLUTION: A frame-receiving device 11 is provided with a cavity 11d, which being square as viewed from above, houses a sealing resin 3. A gate residue hosing part 11c is provided at a corner part of 1, corresponding to a gate residue 3b at a lower surface of a corner part (unnecessary part) 2a of a lead frame 2, among four corner parts of the cavity 11d. In addition, at a boundary part between the cavity 11d and the date residue housing part 11c, a lower gate punch 11a is provided. By mounting the lead frame 2 on the frame receiving die 11, the sealing resin 3 is housed in the cavity 11d, while the gate residue 3b is housed in the gate residue housing part 11c.
Inventors:
Aoki, Hideji
Sekiya, Hidenori
Kato, Kenichiro
Nishitani, Hiroshi
Sekiya, Hidenori
Kato, Kenichiro
Nishitani, Hiroshi
Application Number:
JP27088797A
Publication Date:
May 31, 2004
Filing Date:
October 03, 1997
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
MITSUBISHI ELECTRIC ENGINEERING CO LTD
MITSUBISHI ELECTRIC ENGINEERING CO LTD
International Classes:
B29C45/26; B29C45/14; H01L21/48; H01L21/56; H01L23/50; B29L31/34; (IPC1-7): H01L21/56; B29C45/14; B29C45/26; H01L23/50
Attorney, Agent or Firm:
吉田 茂明 （外２名）
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