PURPOSE: To reduce defective elements and improve yield by forming an opposing first electrodes in bar shape, forming film on a substrate attached to a second electrode while performing reciprocating motion in parallel and relatively in reference to the first and second electrodes, and by etching the formed film.

CONSTITUTION: One electrode 13 is formed in bar shape. The electrode 13 and the other electrode 12 where a substrate 14 opposing this bar-shaped electrode 13 is attached are relatively reciprocated. Then, a curtain-shaped plasma layer generated by the bar-shaped electrode 13 performs reciprocating motion on the substrate surface, applying energy from plasma to the entire surface of the substrate 14 uniformly. Thus, it is possible to form a film uniformly on a substrate having a large diameter and to perform etching without unevenness in etching rate, to reduce failure in elements formed on the same substrate 14, and to improve yield.