PURPOSE: To prevent the leakage of a sealing resin due to a transfer molding and to form a resin-sealed external shape having a prescribed thickness and a prescribed configuration by a method wherein an area, where a semiconductor device is package, is surrounded with die bars, whose thickness are identical with those of outer leads.

CONSTITUTION: Fingers 2, outer leads 3 and tie bars 6 are simultaneously formed on a film carrier 1 in the same thickness in such a way as to encircle a device hole 8 and a semiconductor chip 5 is connected to the fingers 2 from the back side of the carrier 1 by a thermocompression bonding or the like. After that, metal mold 11 for enclosing the chip 5 are mounted and a sealing resin 12 is injected through a pot 10. After the resin 12 is cured, the metal mold 11 is removed and the remaining tie bars 6 and a gate 7 are cut off. Thereby, even if the resin 12 is injected in the recess of the metal mold 11, the resin 12 does not leak from the gaps between the leads 3 and a resin-sealed external shape having a prescribed thickness and a prescribed configuration can be formed.