Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5815248
Kind Code:
A
Abstract:
PURPOSE:To reduce the size of a semiconductor element by scribing a notch with a diamond stylus on the second main surface remotely isolated from a function part such as a p-n junction, and pelletizing the element, thereby suppressing the deterioration of the characteristics of the element due to the scribing. CONSTITUTION:A p-n junction 1 is formed in the vicinity of the first main surface 3 of a semiconductor wafer 6. The wafer 6 is mounted with the surface underside on a transparent vinyl sheet 7 with an adhesive substance on the surface. An electrode pattern formed on the first surface 3 through the sheet 7 is observed by a microscope 12, the position of a diamond stylus 8 of a diamond scriber is adjusted to the pattern, and a notch 4 is scribed on the second main surface 9 along the cleavage with the stylus 8 in Fig. A. The sheet 7 and the wafer 6 and covered with a vinyl sheet 10 in Fig. B, a warpage is applied to the wafer 6, thereby cleaving the wafer 6 along the notch 4.
Inventors:
UJI TOSHIO
Application Number:
JP11335381A
Publication Date:
January 28, 1983
Filing Date:
July 20, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/301; H01L21/302; (IPC1-7): H01L21/78
Domestic Patent References:
| JPS567448A | 1981-01-26 |
Attorney, Agent or Firm:
Uchihara Shin