Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5831545
Kind Code:
A
Abstract:
PURPOSE:To improve effectively produce a meniscus by applying heat to the region outside of the end of a lead, thereby sufficiently melting the metal of an internal terminal. CONSTITUTION:In the step of applying heat and pressure by a jig to the internal terminal of a ceramic substrate at the outer end of a fine metal strip connected to the projected electrode of a semiconductor chip to melt and connect the strip to the terminal, the outer edge of the jig is disposed outside the terminal of the strip. Heat is applied by the heating and pressurizing jig to the region exceeding the end 4' of the lead 4, thereby allowing most or the metal plated to the internal terminal 9 to melted by the radiated heat, thereby forming a sufficient meniscus on the side surface of the lead 4 to effectively connect the lead to the internal terminal and largely increasing the manufacturing yield and the reliability of a semiconductor device.
Inventors:
MIYAMOTO TAKASHI
Application Number:
JP12905081A
Publication Date:
February 24, 1983
Filing Date:
August 18, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JPS5355965A | 1978-05-20 |
Attorney, Agent or Firm:
Shin Uchihara