Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS59181622
Kind Code:
A
Abstract:
PURPOSE:To prevent the adhesion of an exfoliating piece on a wafer during treatment and the generation of temperature trouble by vertically holding the wafer and growing a film through sputtering by using a heat-resistant electrostatic chuck, which can control a temperature. CONSTITUTION:With an electrostatic chuck 10, electrodes 12a (positive) and 12b (negative) are mounted into a heat-resistant insulating film 10a, a wafer 9 is sucked by an electrostatic field formed by these electrodes 12a and 12b, and no pawl is needed. A thermocouple 14 is disposed into the insulating film 10a to detect the temperature of the wafer at all times, and the temperature of the wafer 9 can be kept at a constant one by a temperature controller 17 mounted to the electrostatic chuck 10.
Inventors:
INOUE MINORU
Application Number:
JP5585083A
Publication Date:
October 16, 1984
Filing Date:
March 31, 1983
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C23C14/50; C23C14/48; H01L21/203; H01L21/285; H01L21/31; (IPC1-7): C23C15/00; H01L21/203; H01L21/285
Domestic Patent References:
| JPS57148356A | 1982-09-13 | |||
| JPS53139980A | 1978-12-06 | |||
| JPS5277671A | 1977-06-30 | |||
| JPS482026A | ||||
| JP57231944A |
Attorney, Agent or Firm:
Motoki Hisagi (1 outside)