Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS59191337
Kind Code:
A
Abstract:
PURPOSE:To enable to easily detect the shaving amount of resin material in the burr-removing process by a method wherein burrs are removed after a recessed part has been formed on the surface of the resin material. CONSTITUTION:A semiconductor chip 2 is mounted on the bed part 1a located on a lead frame 1, and after the electrode part of the semiconductor chip 2 and an inner lead part 1b have been electrically connected, the semiconductor chip 2, the bed part 1a, the inner lead part 1b and the wire 3 are sealed in a resin material 10 by performing a low voltage transfer molding method. At this time, a recessed part 11 is formed on the surface of the resin material 10 simultaneously. Then, abrasive material is sprayed using high pressure an the burrs adhered to the outer lead part 1c are removed. The shaved amount of the surface of the resin material can be detected by checking the condition of the recessed part 11 after the burr-removing work has been finished.
Inventors:
IKEDA TADASHI
Application Number:
JP6526383A
Publication Date:
October 30, 1984
Filing Date:
April 15, 1983
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L21/66; H01L21/56; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Noriyuki Noriyuki