Title:
MANUFACTURE OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS5967637
Kind Code:
A
Abstract:
PURPOSE:To improve the adhesive property of a glass protective film and a semiconductor surface by roughening a section, to which the glass film is formed, of a semiconductor. CONSTITUTION:When the surface of a semiconductor board, the inside thereof has a junction, is chemically treated finally and molded and a molding section is coated with the glass protective film, the section coated with the glass film is roughened through the spray-up of sand or similar materials before final chemical treatment, the adhesive property of the glass film and the semiconductor surface is improved, and the generation of cracks in the glass film and the exfoliation of the glass film are prevented. A semiconductor pellet 1, to which the P-N junction is formed, is used, and grooves 2 are formed by repeating a sand blast by a nozzle and the spray-up of a mixed acid by a nozzle. A sample in which the grooves 2 are buried with glass displays characteristics more excellent than samples with conventional resin protective films in an initial characteristics test and a repetition load reliability test.
Inventors:
YOKOYAMA HIROSHI
Application Number:
JP17872582A
Publication Date:
April 17, 1984
Filing Date:
October 12, 1982
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/304; H01L21/316; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Iwao Yamaguchi