PURPOSE: To make manufacturing the title component easy by etching the electroless plating of a section, to which a solder film is not formed, in the surface of a semiconductor porcelain element assembly, to which electroless plating is executed, and using a required region as an electrode.

CONSTITUTION: A semiconductor porcelain dielectric 1 is dipped into a sensitizing liquid, and immersed into an activating liquid containing Pd2+ ions. The semiconductor porcelain dielectric 1 is dipped into an electroless Ni plating solution, and an electroless Ni film 2 is shaped onto the surface of a porcelain. A solder film 3 is formed in such a manner that solder paste is applied to the required section of the semiconductor porcelain dielectric 1 coated with the electroless Ni plating film 2 by employing screen printing, and reflow treatment in which the solder paste is heated and melted at 230°C is executed. The Ni plating film in an unnecessary region is removed through etching by immersion into the etchant of the Ni plating film, and washed by pure water and dried. Accordingly, electrodes 4 composed of the electroless Ni plating films 2 and the solder films 3 are shaped to the semiconductor porcelain dielectric 1.