To provide a semiconductor manufacturing method and a resist applicator, where resist is well and stably applied onto a semiconductor wafer or the like even if the wafer has high hydrophobic properties.

This method comprises a process where resist is applied onto a semiconductor wafer, exposed to light, and developed into a resist pattern. At this point, the applied surface of the semiconductor wafer is subjected to a surface treatment with an alkaline processing solution such as a resist developing solution before resist is applied. This resist applicator which applies photoresist onto the semiconductor wafer when this semiconductor is manufactured is provided with a processing part 1 which enables the resist-coated surface of the semiconductor wafer undergo a surface treatment with an alkaline processing solution.