PURPOSE: To raise the mechanical strength of tablets themselves and prevent them from cracking and chipping during the time of transportation and automatic molding in an MOS method by tablet-making in a state of heating resin composition powder or performing heat-treatment after tablet-making the resin composition powder.
CONSTITUTION: Resin composition powder is tablet-made in a state of heating, or the resin composition powder is heated after tablet-making in an ordinary temperature. In particular, in the resin composition, silica filling agent is highly filled at 60 vol.% or more, and silicon flexibile agent is blended therein, and it is preferred to be a resin composition compounded with these agents. And, by making the heating temperature of the resin composition powder or resin composition tablet lower than the softening point or below of the resin composition, the mechanical strength can be considerably improved in remaining the shape and resin property of the tablet as being stable.
MIYABAYASHI KAZUHIKO
KOUJIMA HIROOKI
CHIHAMA JIYUNICHI
INAGAWA SETSU
URANO TAKASHI
SUZUKI HIROSHI
| JPS6471137A | 1989-03-16 | |||
| JPS62261404A | 1987-11-13 |