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Title:
MANUFACTURE OF THIN BAMBOO PLATE, CUTTING DEVICE, AND THIN PLATE
Document Type and Number:
Japanese Patent JPH11314204
Kind Code:
A
Abstract:

To form a thin, long and broad plate by a method wherein either lengths or widths of bamboo worked plated are trued up so as to laminate in the direction of the thickness to one another through an adhesive in order to obtain a laminated material by drying them under the required temperature and pressure and for the require time so as to cut the resultant laminated material being pushed against a cutting part in a plate having a specified thickness.

By bonding bamboo worked plates lengthwise and widthwise or either lengthwise or widthwise for widening into a large-sized plate and, at the same time, by laminating them in the direction of the thickness, a thick laminated material 1 is obtained. In this case, the laminated material 1 is formed by clampingly drying them under the required temperature and pressure and for the required time. Next, the laminated material 1 is cut with a cutting device 11 consisting of a transferring part and a fixed part comprising a holding and a feeding mechanisms and a cutting part equipped with an endless band saw 28. Under the state that the top and under surfaces and one of side surfaces of the laminated material 1 are held down, and the laminated material 1 is kept normal or parallel to the cutting blade surface of the band saw 28, the laminated material is cut longitudinally into a thin plate having the thickness of 0.8-15 mm.


Inventors:
YOSHIDA SEIJI
Application Number:
JP5517099A
Publication Date:
November 16, 1999
Filing Date:
March 03, 1999
Export Citation:
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Assignee:
NIPPON BLOWER KOGYO KK
International Classes:
B27J1/00; B27B13/00; B27G11/00; (IPC1-7): B27J1/00; B27B13/00; B27G11/00
Attorney, Agent or Firm:
Takashi Takeuchi