Title:
MANUFACTURE OF VINYL ACETATE RESIN EMULSION AND AQUEOUS ADHESIVE
Document Type and Number:
Japanese Patent JP3476714
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a vinyl acetate resin emulsion having excellent low temp. film formation and adhesion strength without contg. a plasticizer and particularly having high adhesion strength even at a low temp. curing.
SOLUTION: In manufacturing a vinyl acetate resin emulsion by seed polymerizing vinyl acetate in an ethylene-vinyl acetate copolymerization resin emulsion, a process of seed polymerizing the vinyl acetate while adding it into the system and a process of adding a polymerizable unsaturated monomer other than vinyl acetate into the system as a pre- or a post-process of the former process are included. The quantity of the polymerizable unsaturated monomer other than vinyl acetate used is, e.g. about 0.05-10 pts.wt. based on 100 pts.wt. vinyl acetate. As the polymerizable unsaturated monomer other than vinyl acetate, at least one monomer selected from acrylate esters, methacrylate esters, vinyl esters, and vinyl ethers can be used.
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Inventors:
Toshiki Orikuchi
Shintaro Ogawa
Shintaro Ogawa
Application Number:
JP19807099A
Publication Date:
December 10, 2003
Filing Date:
July 12, 1999
Export Citation:
Assignee:
Konishi Co., Ltd.
International Classes:
C08F2/44; C08F2/16; C08F2/22; C08F18/08; C08F255/02; C08F263/04; C08F285/00; C08L51/00; C09D151/00; C09J131/04; C09J151/00; (IPC1-7): C08F2/22; C08F18/08; C09J131/04
Domestic Patent References:
| JP10292081A | ||||
| JP5716059A | ||||
| JP2000239307A |
Attorney, Agent or Firm:
Yukihisa Goto