Title:
MANUFACTURE OF WIRING BOARD AND MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP3216789
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance the productivity of manufacturing processes.
SOLUTION: A wire is laid in a single run on a wiring board 1 through which a wire holding groove 2 and a tool through hole 3 are provided, and is held in the wire holding groove 2, and the wiring board 1 is laid on top of another wiring board on which a pressure connection terminal is placed, to place the wiring board 1 on the wiring board mount 12 of a wiring board manufacturing device A. A pressure welding cutting blade 17 and a crimper 18 which are fitted to a presser 15 are passed through the tool through hole 3 in the wiring board 1 and the wire in the wire holding groove 2 is pressed so that cutting of the wire, pressure welding and tightening of the wire to the pressure welding terminal, and the transfer of the wire to the wire holding groove in the wiring board are performed in a single stroke by pressing them with the presser 15.
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Inventors:
Sanae Kato
Takeshi Koyama
Takeshi Koyama
Application Number:
JP7720096A
Publication Date:
October 09, 2001
Filing Date:
March 29, 1996
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R43/01; H02G3/16; H05K3/10; (IPC1-7): H01R43/01; H02G3/16; H05K3/10
Domestic Patent References:
| JP9148036A | ||||
| JP4171688A | ||||
| JP5753083A |
Attorney, Agent or Firm:
Hiroshi Ochi (4 others)
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