Title:
MANUFACTURING DEVICE FOR THIN ELECTRONIC CIRCUIT COMPONENT, AND THE THIN ELECTRONIC CIRCUIT COMPONENT
Document Type and Number:
Japanese Patent JPH11289149
Kind Code:
A
Abstract:
To provide a highly productive thin electronic circuit component manufacturing method with which an electronic circuit can be dried up in a short time.
A conductive paste 32 printed on the surface of a film 10 is dried up by the laser beam emitted from laser devices 40A, 40B and 40C, and an electronic circuit is formed. A YAG laser device 40A, is a YAG laser having the laser wavelength of 1.06 μm, and laser devices 40B and 40C use a laser wavelength of 10.6 μm.
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Inventors:
MATSUMOTO TAKASHI
MIYAUCHI TAKEOKI
WAI SHINICHI
MIYAUCHI TAKEOKI
WAI SHINICHI
Application Number:
JP9213898A
Publication Date:
October 19, 1999
Filing Date:
April 06, 1998
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B42D15/10; G06K19/077; H05K1/11; H05K3/12; (IPC1-7): H05K3/12; B42D15/10; G06K19/077; H05K1/11
Attorney, Agent or Firm:
Kasuga