Title:
PC部材の製造装置および製造方法
Document Type and Number:
Japanese Patent JP4029108
Kind Code:
B1
Inventors:
Kenji Yokoi
Makimoto
Akira Otake
Makimoto
Akira Otake
Application Number:
JP2006178109A
Publication Date:
January 09, 2008
Filing Date:
June 28, 2006
Export Citation:
Assignee:
Taisei Corporation
International Classes:
B28B23/06
Domestic Patent References:
| JP60072210U | ||||
| JP2004346630A | ||||
| JP9099420A | ||||
| JP2006159581A |
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Yasushi Hayakawa
Ishikawa Takiharu
Sekiya Mitsuo
Yasushi Hayakawa
Ishikawa Takiharu