Title:
SOI基板の製造方法
Document Type and Number:
Japanese Patent JP5038618
Kind Code:
B2
Inventors:
Tetsuya Nakai
High Fengyun
Keishi Yamada
High Fengyun
Keishi Yamada
Application Number:
JP2005333620A
Publication Date:
October 03, 2012
Filing Date:
November 18, 2005
Export Citation:
Assignee:
Sumco inc.
Toshiba Corporation
Toshiba Corporation
International Classes:
H01L27/12; H01L21/02; H01L21/76
Domestic Patent References:
| JP62274626A | ||||
| JP2191357A | ||||
| JP2005026644A | ||||
| JP2001308025A | ||||
| JP2218159A | ||||
| JP2005051139A | ||||
| JP2004207387A | ||||
| JP7176608A | ||||
| JP5129536A |
Attorney, Agent or Firm:
Masayoshi Suda