Title:
Manufacturing method of adhesive film, film winding body, connecting body
Document Type and Number:
Japanese Patent JP6297381
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress squeeze of an adhesive component by tight winding of an adhesive film and to prevent blocking even when tight winding is induced by a tension upon drawing out the adhesive film.SOLUTION: An adhesive film 20 includes: a first adhesive layer 23 supported by a release film 21; and a second adhesive layer 24 that is laminated on the first adhesive layer 23 and has a smaller width than that of the first adhesive layer 23 and a viscosity at 30°C lower than that of the first adhesive layer 23.
Inventors:
Masahiro Iiyama
Application Number:
JP2014064858A
Publication Date:
March 20, 2018
Filing Date:
March 26, 2014
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
C09J7/20; C09J9/02; C09J201/00; H05K3/32
Domestic Patent References:
| JP2007204508A | ||||
| JP2003142176A |
Foreign References:
| WO2009001771A1 | ||||
| WO2007015372A1 | ||||
| WO2008053824A1 |
Attorney, Agent or Firm:
Nobuhiro Noguchi
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