Title:
粘着シート、電子部品の製造方法
Document Type and Number:
Japanese Patent JP6506756
Kind Code:
B2
Abstract:
An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.
Inventors:
Tomoya Tsukui
Gosuke Nakajima
Gosuke Nakajima
Application Number:
JP2016534376A
Publication Date:
April 24, 2019
Filing Date:
July 06, 2015
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
C09J7/30; C09J7/35; C09J11/06; C09J11/08; C09J133/06; C09J167/06; C09J175/14; H01L21/301
Domestic Patent References:
| JP2012039053A | ||||
| JP10298507A | ||||
| JP2013143489A | ||||
| JP2007100064A |
Foreign References:
| WO2013105455A1 | ||||
| WO2013175987A1 |
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito