Title:
アルミニウム回路基板の製造方法
Document Type and Number:
Japanese Patent JP6999117
Kind Code:
B2
Abstract:
Disclosed is a method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.
Inventors:
Seiji Kuroda
Hiroshi Araki
Akira Hasegawa
Makoto Watanabe
Atsushi Sakai
Yoshitaka Taniguchi
Suzuya Yamada
Hiroshi Araki
Akira Hasegawa
Makoto Watanabe
Atsushi Sakai
Yoshitaka Taniguchi
Suzuya Yamada
Application Number:
JP2019501418A
Publication Date:
January 18, 2022
Filing Date:
February 22, 2018
Export Citation:
Assignee:
National Institute for Materials Science
Denka Co., Ltd.
Denka Co., Ltd.
International Classes:
C23C24/04; B32B15/01; B32B15/04; B32B18/00; B32B37/15; H05K3/14
Domestic Patent References:
| JP2003089883A | ||||
| JP2009206443A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Takeshi Nakatsuka
Hideki Okita
Yoshinori Shimizu
Takeshi Nakatsuka
Hideki Okita
Previous Patent: Human state estimation device and human state estimation program
Next Patent: Image processing equipment
Next Patent: Image processing equipment