Title:
アンテナ基板の製造方法、配線と電極付きアンテナ基板の製造方法およびＲＦＩＤ素子の製造方法
Document Type and Number:
Japanese Patent JP6766649
Kind Code:
B2
Abstract:
An object of the present invention is to provide a method for accurately forming an antenna substrate as well as an antenna substrate with wiring line and electrode by a coating method. One aspect of the present invention provides a method for producing an antenna substrate with wiring line and electrode including the steps of: (1) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate; (2-A) processing the coating film into a pattern corresponding to an antenna by photolithography; (2-B) processing the coating film into a pattern corresponding to a wiring line; (2-C) processing the coating film into a pattern corresponding to an electrode; (3-A) curing the pattern corresponding to an antenna into an antenna; (3-B) curing the pattern corresponding to a wiring line into a wiring line; and (3-C) curing the pattern corresponding to an electrode into an electrode.
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Inventors:
Junji Wakita
Koji Shimizu
Seiichiro Murase
Koji Shimizu
Seiichiro Murase
Application Number:
JP2016553031A
Publication Date:
October 14, 2020
Filing Date:
August 10, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
H01P11/00; G06K19/077; H01Q1/38
Domestic Patent References:
| JP2005229534A | ||||
| JP2014170051A | ||||
| JP2005228785A | ||||
| JP2010008578A |