Title:
基板組立体の製造方法
Document Type and Number:
Japanese Patent JP4028240
Kind Code:
B2
Abstract:
A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.
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Inventors:
Albert Wu Chan
Michael Gee Lee
Mark Thomas McCormack
Solomon I Beilin
Michael Gee Lee
Mark Thomas McCormack
Solomon I Beilin
Application Number:
JP2002000853A
Publication Date:
December 26, 2007
Filing Date:
January 07, 2002
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/60; B32B7/12; H01L21/58; H01L21/68; H05K3/46; H05K3/34
Domestic Patent References:
| JP2000114206A | ||||
| JP62169433A | ||||
| JP2000332167A | ||||
| JP4280443A | ||||
| JP2002190497A |
Attorney, Agent or Firm:
Tadahiko Ito