Title:
セラミックス接合体の製造方法
Document Type and Number:
Japanese Patent JP5669472
Kind Code:
B2
Abstract:
A bonding material (12), which is composed of a sheet-like molded body containing fine particles of a compound composed of a metal element or a semi-metal element and a nonmetal element, is disposed between material pieces (10A, 10B) to be bonded, which are composed of a ceramic composed of the compound, and layers (11A, 11B) composed only of a metal element or a semi-metal element are disposed between the material pieces (10A, 10B) and the bonding material (12), and a multilayer structure (20) is formed. Then, in a state wherein a load is applied to the multilayer structure (20), the multilayer structure (20) is fired under the atmosphere of the non-metal element or under the atmosphere of a compound containing the non-metal element, and a bonded body (1) is formed. The bonded body (1) is heat-treated under the load equivalent to or lower than that applied when firing is performed.
Inventors:
井筒 靖久
北 英紀
宮崎 広行
近藤 直樹
北 英紀
宮崎 広行
近藤 直樹
Application Number:
JP2010167662A
Publication Date:
February 12, 2015
Filing Date:
July 27, 2010
Export Citation:
Assignee:
三井金属鉱業株式会社
独立行政法人産業技術総合研究所
独立行政法人産業技術総合研究所
International Classes:
C04B37/00; B32B18/00
Attorney, Agent or Firm:
Osamu Hatori
Yoshiyuki Matsushima
Yoshiyuki Matsushima