Title:
MANUFACTURING METHOD OF CERAMIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2018018971
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate capable of forming a conductor pattern or a via wiring part in a ceramic substrate with high location accuracy, by suppressing deformation of a green sheet based on deformation of a carrier film in thermocompression bonding of a lamination process.SOLUTION: A manufacturing method of a ceramic substrate includes a step of forming a laminate laminating more than one green sheets 1, by laminating a green sheet 3 with a carrier film on other green sheet 1 so that the green sheets 1 face each other, thermocompression bonding, and then peeling the carrier film 2, and a step of calcining the laminate. The thermocompression bonding is performed under conditions of applying a predetermined surface pressure of 1-11 MPa for 3-15 seconds at a temperature of over 40°C and lower than 80°C, and the absolute value of maximum dimensional change rate of the green sheet 1 in the in-plane direction is 33.0×10or less before and after the thermocompression bonding.SELECTED DRAWING: Figure 2
Inventors:
SAKAGUCHI KOHEI
YAMASHITA HIRONAO
YAMASHITA HIRONAO
Application Number:
JP2016148463A
Publication Date:
February 01, 2018
Filing Date:
July 28, 2016
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
H05K3/46; B28B11/00; B32B18/00; H05K3/00
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
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