キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法

Title:

キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法

Document Type and Number:

Japanese Patent JP6415760

Kind Code:

B2

Abstract:

There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

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Inventors:

Matsuura Yoshinori

Application Number:

JP2017565853A

Publication Date:

October 31, 2018

Filing Date:

February 21, 2017

Export Citation:

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Assignee:

Mitsui Mining & Smelting Co., Ltd.

International Classes:

H05K1/09; B32B15/01; B32B17/06; B32B18/00; C23C14/06; H05K3/46

Domestic Patent References:

JP5859155B2
JP2007307767A
JP2015050314A
JP2016026914A
JP2015207580A
JP2015213142A

Foreign References:

WO2012133638A1

Attorney, Agent or Firm:

Masaharu Takamura
Hiroki Kashima
Taku Takeishi

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