Title:
研磨パッド用クッション層の製造方法
Document Type and Number:
Japanese Patent JP5105559
Kind Code:
B2
Abstract:
A polishing pad includes a polishing layer having abrasive grains dispersed in a resin and is characterized in that the resin is a resin containing ionic groups in the range of 20 to 1500 eq/ton.
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| JP2002307293 | POLISHING CLOTH |
| JP5607227 | Polish device |
| JP2008221367 | POLISHING PAD |
Inventors:
Koichi Ono
Tetsuo Shimomura
Masahiko Nakamori
Takatoshi Yamada
Shigeru Komai
Masayuki Tsutsumi
Tetsuo Shimomura
Masahiko Nakamori
Takatoshi Yamada
Shigeru Komai
Masayuki Tsutsumi
Application Number:
JP2010267365A
Publication Date:
December 26, 2012
Filing Date:
November 30, 2010
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO.,LTD.
International Classes:
B24B37/20; B24B37/22; B24B37/24; B24D3/28; B24D11/00; H01L21/304
Domestic Patent References:
| JP9117855A | ||||
| JP2000232082A | ||||
| JP6179174A | ||||
| JP8108372A | ||||
| JP3202281A |
Foreign References:
| WO1998030356A1 | ||||
| WO1999024218A1 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office