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Title:
MANUFACTURING METHOD AND DEVICE FOR POLISHING PAD, POLISHING PAD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE BY USE OF THIS POLISHING PAD
Document Type and Number:
Japanese Patent JP2009190107
Kind Code:
A
Abstract:

To provide a method and device for manufacturing a polishing pad easily and stably by preventing the occurrence of warping, wrinkle or the like of the polishing pad, also preventing deterioration with age of polishing characteristics, and achieving stable polishing from the initial stage of its use and excellent in-plane uniformity.

A laminating process in this manufacturing method includes a process of sticking laminated members mutually by making the laminated member constituted by laminating a polishing layer 1 on a cushion layer 3 through an adhesive layer, and an external frame member 2 having a larger inside diameter than the outside diameter of the polishing layer 1 and put on the cushion layer 3 through an adhesive layer to surround the outer periphery of the polishing layer 1, pass through between a pair of laminating rolls simultaneously, and by pressing them.


Inventors:
KIMURA TAKESHI
KAZUNO ATSUSHI
NAKAMURA KENJI
NAKAI YOSHIYUKI
OGAWA KAZUYUKI
Application Number:
JP2008031715A
Publication Date:
August 27, 2009
Filing Date:
February 13, 2008
Export Citation:
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Assignee:
TOYO TIRE & RUBBER CO
International Classes:
B24B37/20; B24B37/22; H01L21/304
Domestic Patent References:
JP2007518277A2007-07-05
JP2004193390A2004-07-08
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office



 
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