To provide a method and a device for manufacturing a printed wiring board with high production efficiency which are capable of solving the problem, sufficiently removing a resist film, and easily keeping a processing solution clean.

The printed wiring board manufacturing method comprises a first process of forming a resist film on a laminated board composed of an insulating board and a copper foil laminated on it, a second process of etching the laminated board, a third process of removing the resist film, and a fourth process of forming a wiring pattern. The resist film removing process comprises a first removing process of separating the resist film kept in a solid state, and a second removing process of dissolving the resist film in a processing solution. The resist film is removed from the insulating board where a patterned copper foil and the resist film covering the copper foil are laminated through the printed wiring board manufacturing device, and the manufacturing device is equipped with a first removing tank for separating the resist film and a second removing tank for dissolving the resist film.