To adhere a multiplicity of IC chips to a base material sheet body comprising a packaging material or the like while positioning them at predetermined intervals.
The base material sheet body 10 having a base material sheet 11 is prepared, and the base material sheet body 10 is inserted between a form cylinder 30 and an impression cylinder 31. The IC chips 20 are supplied from an IC chip supply nozzle 37a in an upper part of the form cylinder 30. The IC chips 20 supplied to a surface 30a of the form cylinder 30 is smoothly drawn into a recessed part 31 maintained at a negative pressure by a suction source 35 and a suction tube 36. The IC chips 20 in the recessed part 31 are transferred to a base material sheet body 10 side by pressurizing the base material sheet body 10 between the form cylinder 30 and the impression cylinder 31.
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IGARASHI AKIHIKO
SHIMOMURA KIICHI
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma