Title:
MANUFACTURING METHOD OF ELECTROMAGNETIC WAVE ATTENUATION FILM
Document Type and Number:
Japanese Patent JP2023172933
Kind Code:
A
Abstract:
To provide a manufacturing method capable of easily and surely obtaining an electromagnetic wave attenuation film of a two-layer conductive pattern system.SOLUTION: A manufacturing method of an electromagnetic wave attenuation film of the present invention contains: a step of forming a predetermined repeating pattern composed of a plurality of conductive elements on a front surface of a dielectric base material and a predetermined repeating pattern composed of a plurality of conductive elements on a rear surface of the dielectric base material on front and back surfaces at the same time; a step of laminating a support layer to the back surface of the dielectric base material on which the patters are formed on the front and back surfaces; and a step of forming a flat plate inductor on the rear surface of the support layer. The manufacturing method may contain: a step of forming the flat plate inductor on the rear surface of the support layer; and a step of pasting the front surface of the support layer on which the flat plate inductor is formed to the rear surface of the dielectric base material on which the pattern is formed on the front and back surfaces.SELECTED DRAWING: Figure 2
Inventors:
AOKI ATSUKO
KONDO SHIMPEI
FUJITA TORU
IMAI MIHO
KODAKA RYOSUKE
KONDO SHIMPEI
FUJITA TORU
IMAI MIHO
KODAKA RYOSUKE
Application Number:
JP2023083630A
Publication Date:
December 06, 2023
Filing Date:
May 22, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC
International Classes:
H05K9/00; B32B7/025; H05K3/46
Attorney, Agent or Firm:
Patent Attorney Corporation Daiichi International Patent Office
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