Title:
電磁波シールド材の製造方法
Document Type and Number:
Japanese Patent JP5002634
Kind Code:
B2
Abstract:
The present invention is to provide an electromagnetic wave shielding material which comprises a transparent substrate and a fine line pattern formed thereon, wherein the fine line pattern comprises a metal plating film using a physically developed metal silver as a catalytic nucleus and a process for preparing an electromagnetic wave shielding material which comprises exposing a light-sensitive material having a physical development nuclei layer and a silver halide emulsion layer on a transparent substrate in this order, precipitating metal silver with an optional fine line pattern onto the physical development nuclei layer by physical development, then, removing a layer provided on the physical development nuclei layer, and subjecting to plating a metal with the use of the physically developed metal silver as a catalytic nucleus
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Inventors:
Taro Yoshida
Atsufumi Suzuki
Yasuo Tsubakii
Kazuhisa Kobayashi
Atsufumi Suzuki
Yasuo Tsubakii
Kazuhisa Kobayashi
Application Number:
JP2009228150A
Publication Date:
August 15, 2012
Filing Date:
September 30, 2009
Export Citation:
Assignee:
Fujimori Industry Co., Ltd.
Mitsubishi Paper Mills Co., Ltd.
Mitsubishi Paper Mills Co., Ltd.
International Classes:
C25D5/02; C23C18/16; C23C18/28; C23C18/31; C25D5/56; C25D7/00; C25D7/06; H05K9/00
Domestic Patent References:
| JP49002621B1 | ||||
| JP4282639A | ||||
| JP7134421A | ||||
| JP11232939A | ||||
| JP2000040896A | ||||
| JP4429901B2 |
Foreign References:
| WO2004007810A1 |
Attorney, Agent or Firm:
Hajime Tsukuni