Title:
電子アセンブリの製造方法及び電子アセンブリ
Document Type and Number:
Japanese Patent JP6972491
Kind Code:
B2
Abstract:
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
Inventors:
Isohatara, Anne
Shinivara, Hasse
Heikkinen, Mikko
Shinivara, Hasse
Heikkinen, Mikko
Application Number:
JP2020504447A
Publication Date:
November 24, 2021
Filing Date:
April 05, 2018
Export Citation:
Assignee:
Tact Tech OEE
International Classes:
H01L23/12; B29C45/14; H01F17/00; H01F27/28; H01F38/14; H01P11/00; H01Q13/08; H02J50/05; H02J50/10
Domestic Patent References:
| JP2011518425A | ||||
| JP2009541984A | ||||
| JP2014200087A |
Foreign References:
| US20170094800 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Kato Kazunori
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