To reduce damages received by an electronic component by a pressing force to be applied, when pressing and embedding the electronic component into a resin sheet, even if the electronic component mounted in the resin sheet is thinned.
A bonding electronic part 23, in which the other surfaces of electronic parts 26, 27 having electrode terminals 24, 25 on at least one surfaces are stuck and aligned, is embedded in the resin sheet 22, to expose the electrode terminals 24, 25. In this way, the electronic components 26, 27 are stuck to improve a packaging density, and rigidity is improved. Accordingly, damages to the bonding electronic part 23 can be reduced by the pressing force to be applied, when the bonding electronic component 23 is embedded.
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