Title:
MANUFACTURING METHOD FOR ELECTRONIC COMPONENT AND FUNCTIONAL FILM FORMATION DEVICE FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022170167
Kind Code:
A
Abstract:
To provide a manufacturing method for an electronic component capable of facilitating the production of an electronic component with excellent reliability, and a functional film formation device for an electronic component suitable for the same.SOLUTION: The method is used for manufacturing an electronic component 2 having an element body 4 provided with a plurality of outer surfaces. To the surface of a first rolling member 20, a glass sheet 24 as a transfer layer is detachably attached. On the surface of the first rolling member 20, a portion of a glass sheet 24 is continuously or intermittently adhered to the outer surface of the element body 4 by rolling it so that the outer surfaces of the element body 4 are in contact with the surface of the first rolling member 20 one after another.SELECTED DRAWING: Figure 6E
Inventors:
ISHIZUYA MASAHIDE
Application Number:
JP2021076100A
Publication Date:
November 10, 2022
Filing Date:
April 28, 2021
Export Citation:
Assignee:
TDK CORP
International Classes:
H01G4/30; H01G4/224; H01G13/00
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation
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