Title:
MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE INK, AND INK SET
Document Type and Number:
Japanese Patent JP2023070947
Kind Code:
A
Abstract:
To provide a manufacturing method of an electronic device excellent in adhesiveness and electromagnetic wave shield property and excellent in adhesiveness and electromagnetic wave shield property after a heat cycle test, electronic device ink capable of manufacturing the electronic device, and an ink set.SOLUTION: A manufacturing method of an electronic device and an application thereof include: a step of preparing an electronic substrate comprising a substrate and an electronic component; a step of applying ink for insulating layer formation onto the electronic component to form an insulating layer covering the electronic component; and a conductive layer forming step. The ink for insulating layer formation contains an N-vinyl compound, thiol, and polymerizable monomers other than the N-vinyl compound. The polymerizable monomers other than the N-vinyl compound include at least one kind of polymerizable monomer A selected from a group consisting of a ring content polymerizable monomer including a ring and a cyclized polymerizable monomer. A content of acyl phosphine-based polymerization initiator is 0.1 mass% or less with respect to a total amount of the ink for insulating layer formation.SELECTED DRAWING: Figure 1
Inventors:
KAMOHARA KAZUO
Application Number:
JP2021183439A
Publication Date:
May 22, 2023
Filing Date:
November 10, 2021
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
H05K3/28; B41J2/01; B41M5/00; C08F2/46; C08F26/00; C09D11/101; C09D11/30; C09D11/52; H01L23/00; H01L23/28; H05K9/00
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
Previous Patent: Sheet conveying device and image forming device
Next Patent: Intrinsically safe explosion-proof detection system
Next Patent: Intrinsically safe explosion-proof detection system