To improve the wettability of a brazing material used for joining thereby improving airtightness and allow a worker to easily check joining defects from an appearance when a metal lid is joined to a ceramic substrate on which electronic components are mounted by radiating a laser beam.
An electronic device includes: an electronic component 20 joined onto one surface of an insulation substrate 10; and a metal lid 19 joined onto the metalization layer 13 through a brazing material 19B. The metalization layer includes a joint region 13A and a protruding region 13B. In a manufacturing method of the electronic device, at a process where the metal lid is joined onto the insulation substrate, a peripheral part of the metal lid is disposed on the joint region through the brazing material, and then a laser beam is radiated to the joint region and the protruding part.
| JP2011066651A | 2011-03-31 | |||
| JP2004179373A | 2004-06-24 |
Osamu Suzawa
Kazuhiko Miyasaka