Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP6514619
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of improving flatness of a surface after hardening.SOLUTION: A manufacturing method of an electronic component includes the steps of: coating a surface of a coating object member with an adhesive while using an ink jet device, progressing hardening of the adhesive by irradiation with light and forming a B-staged adhesive part; laminating an electronic component body on a surface of the B-staged adhesive part opposite to a side of the coating object member; and thermally hardening the B-staged adhesive part after the electronic component body is laminated. When a contact angle between the coating object member and the adhesive at 25°C is defined as a contact angle α and a contact angle between the B-staged adhesive part for contact angle measurement and the adhesive at 25°C is defined as a contact angle β, the contact angle α is made equal to or larger than 5° and made equal to or smaller than 50°, and an absolute value of a difference between the contact angle α and the contact angle β is made equal to or larger than 0.1° and equal to or smaller than 15°.SELECTED DRAWING: Figure 1
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Inventors:
Tanigawa Mitsuru
Takashi Watanabe
Yu Yamada
Yusuke Fujita
Yoshito Fujita
Takashi Watanabe
Yu Yamada
Yusuke Fujita
Yoshito Fujita
Application Number:
JP2015195403A
Publication Date:
May 15, 2019
Filing Date:
September 30, 2015
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/52; C09J4/02; C09J11/06; C09J163/00; H05K3/34
Domestic Patent References:
| JP2009177003A | ||||
| JP2012069893A | ||||
| JP2009111340A | ||||
| JP2003100998A |
Foreign References:
| WO2015076235A1 | ||||
| US20120052627 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office