Title:
半導体装置用フィルムの製造方法
Document Type and Number:
Japanese Patent JP5023225
Kind Code:
B1
Abstract:
The present invention aims to provides a method of manufacturing a film for a semiconductor device in which a dicing film, a die bond film, and a protecting film are laminated in this order, including the steps of: irradiating the die bond film with a light ray having a wavelength of 400 to 800 nm to detect the position of the die bond film based on the obtained light transmittance and punching the dicing film out based on the detected position of the die bond film, and in which T2/T1 is 0.04 or more, wherein T1 is the light transmittance of the portion where the dicing film and the protecting film are laminated and T2 is the light transmittance of the portion where the dicing film, the die bond film, and the protecting film are laminated.
Inventors:
Goichi Inoue
Miki Morita
Yuichiro Shishido
Miki Morita
Yuichiro Shishido
Application Number:
JP2011052973A
Publication Date:
September 12, 2012
Filing Date:
March 10, 2011
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/52; C09J7/02; C09J201/00; H01L21/301
Domestic Patent References:
| JP2010245191A | 2010-10-28 | |||
| JP2011111530A | 2011-06-09 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office