Title:
フラックスおよび電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP7328311
Kind Code:
B2
Abstract:
To provide a flux that is able to temporarily fix a preform solder or an electronic component at a low temperature about room temperature.SOLUTION: A flux contains a Rosin compound and two or more kinds of organic solvents and is used by its being applied onto a substrate. The content ratio of the Rosin compound is more than 30% by mass, and the viscosity of the flux measured at 20°C by a B-type viscometer is 2000 mPa s or less. Further, the tack force T is 50 gf or more when measured by the following procedure: (1) a Ni-plated Al plate having a circular recess of a 7-mm-diameter and a 0.2-mm-depth in at least one surface is coated with an amount of flux that fills the recess; (2) the coated Al plate is heated at 50°C for 15 minutes; (3) after the heated Al plate is left to be cooled to room temperature, the tack force T of the flux present in the recess is measured using a Tackiness Tester under the conditions of a press time of 0.2 sec, a press pressure of 50 gf, an entry speed of 2.0 mm/sec, and a separation speed of 10 mm/sec.SELECTED DRAWING: Figure 1
Inventors:
Yasuhisa Sugawa
Application Number:
JP2021201805A
Publication Date:
August 16, 2023
Filing Date:
December 13, 2021
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/363; H05K3/34
Domestic Patent References:
| JP8213746A | ||||
| JP2001284787A | ||||
| JP4220192A | ||||
| JP201735731A | ||||
| JP201693816A |
Other References:
安全データシート(SDS)、ジエチレングリコールモノ-n-ブチルエーテル、昭和化学株式会社、2020年12月8日、1~7頁
Attorney, Agent or Firm:
Shinji Hayami
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